Au-Sn Solder Paste Market

Report Code - CH2023315A | Industry - Chemicals and Materials | Published on - March, 2023 | Pages - 108 | Format -

Au-Sn Solder Paste Market by Product Type, Application and Region - Global Market Analysis and Forecast (2021 - 2030)




Au-Sn solder paste is used for applications requiring a high melting temperature. It is available in a variety of solder paste forms with different options suited to specific applications. Due to its good thermal fatigue properties, it is widely used in applications requiring high tensile strength and corrosion resistance. When used in step soldering applications, Au-Sn solder paste will not melt when reflowed at low temperatures.

Au-Sn solder paste, which is made from gold and tin and has a relatively low melting point, is commonly used for fabricating RF devices. This paste provides a strong electrical connection between two surfaces even when exposed to high temperatures. With the increasing demand for more powerful and spectrum-efficient mobile devices due to the shift from 2G to 5G technologies, there is a rising need for Au-Sn solder paste in order to maximize power efficiency and spectrum range. This increased need is likely to lead to more market growth of such solder paste.

The demand for Au-Sn solder paste has been on the rise, driven by the rapid expansion of the opto-electronic devices market. The paste is composed of a combination of gold and tin, boasting excellent electrical and thermal conductivity. As consumer electronics & automobiles start incorporating more infrared components, healthcare seeks improved imaging & optical sensing solutions, and physical properties of opto-electronic sensors position them to work in abrasive conditions, these factors have all furthered the growth of opto-electronic devices which ultimately increases demand for Au-Sn solder paste.

This report provides a comprehensive overview of the global au-sn solder paste market. It includes key market data from prominent players in the industry, such as Mitsubishi Materials Corporation, Indium Corporation, AIM Solder, Chengdu Apex New Materials Co., Ltd., Guangzhou Xianyi Electronic Technology Co.,Ltd., Shenzhen Fuyingda Industry Technology Co., Ltd., and provides an in-depth analysis of the competitive landscape and development trends. Furthermore, it examines the key products, players, challenges and developments, and other pertinent information related to the au-sn solder paste market.

Goals and Objectives of the Global Au-Sn Solder Paste Market Study

This study aims to identify the current market landscape of au-sn solder paste and assess its potential for growth in the forecast period. Research will focus on the market drivers, restraints, opportunities, and trends influencing the au-sn solder paste sector. This report will provide an overview of the present market scenario of au-sn solder paste and its future prospects.

  • The reasons for doing this study are to:
    • To create a thorough market breakdown, this report offers an in-depth analysis of the global XYZ industry and its segments.
    • Gain detailed understanding of factors that are promoting and hindering growth in the worldwide au-sn solder paste market.
    • Calculate the estimated size of the worldwide market for au-sn solder paste.
    • Assess the worldwide market of au-sn solder paste with respect to major countries and regions.
    • Conduct a professional evaluation of the market value of key segments in the au-sn solder paste marketplace at the country level.
    • Strategically profile key global companies, and conduct an in-depth analysis of their competitiveness and the overall competitive environment in this market.

The chapter 2 market overview provides a comprehensive overview of the au-sn solder paste market, analyzing macroeconomic factors, market drivers, restraints, opportunities, challenges, value chain analysis, technology roadmap, and Porter 5 force model analysis. Through this professional analysis, readers can gain a better understanding of the market and its potential.

Scope of the Report

The global au-sn solder paste market is comprehensive and provides a thorough analysis and evaluation. It features significant qualitative and quantitative information, tailored to meet the objectives and goals of our target customers.

Attribute Description
Base Year 2022
Historical Year 2021
Forecast Period 2023 - 2030
Market Value US$ Million
Segments Covered

By Product Type: Au80Sn20 , Au78Sn22 and Others .

By Application: Radio Frequency Devices , Opto-electronic Devices , SAW (Surface Acoustic Waves) Filter , Quartz Oscillator and Others .

Geographies Covered

North America: U.S., Canada

Europe: Germany, U.K., France, Italy, Spain, Russia, and the Rest of Europe

Asia Pacific: China, India, Japan, Australia, and the Rest of Asia Pacific

The Middle East and Africa: GCC, South Africa, and the Rest of Middle East and Africa

Latin America: Brazil, Mexico, and the Rest of Latin America

Companies Mitsubishi Materials Corporation, Indium Corporation, AIM Solder, Chengdu Apex New Materials Co., Ltd., Guangzhou Xianyi Electronic Technology Co.,Ltd., Shenzhen Fuyingda Industry Technology Co., Ltd.

Covid-19 Impact Analysis

The COVID-19 pandemic has had a significant effect on the global economy. Various economic sectors have been heavily impacted. The economic decline due to the loss of trillions of dollars is expected to be substantial. The extension and implementation of lockdowns in countries around the world are having a direct impact on economies across the globe.This report includes a chapter dedicated to the analysis of the impact of COVID-19 on the au-sn solder paste market. It is intended as a resource for businesses and industry practitioners to gain a better understanding of the developments in the sector. Detailed insights into market segments, forecasts, leading players, drivers, and restraints are also provided.

Global Au-Sn Solder Paste Market Segmentation

In Chapter 3, segment analysis offers an in-depth look into the market's sub-segments and year-on-year growth projections, aiding readers in recognizing potential market growth opportunities. Through this professional assessment, readers are able to gain a greater understanding of the market's potential.

  • Based on product type, the global au-sn solder paste market is segmented into au80sn20 , au78sn22 and others .
  • Based on application, the au-sn solder paste market is segmented into radio frequency devices , opto-electronic devices , saw (surface acoustic waves) filter , quartz oscillator and others .

Global Au-Sn Solder Paste Market Regional Analysis

Chapter 4 of this report provides a comprehensive regional analysis of the au-sn solder paste market, offering insights into North America, Europe, Asia-Pacific, the Middle East and Africa, and Latin America. Country-wise and segment-wise analyses of each region deliver valuable intelligence to market players, aiding them in making informed decisions. This section is instrumental in forecasting yearly growth and determining the global market share of value.

Global Au-Sn Solder Paste Market Competitive Analysis

Chapter 5 of this report provides a comprehensive competitive analysis, including an analysis of company shares, a list of acquisitions, mergers, collaborations and the introduction of new products. This analysis will enable businesses to make informed decisions in a dynamic market environment.

Global Au-Sn Solder Paste Market Company Profile

The report's Chapter 6 features a comprehensive company profile of the au-sn solder paste market, which includes key industrial actors. Additionally, the report examines the business strategies implemented by the key players on a global, regional, and country-level. Furthermore, the study concentrates on the different business or inorganic business development strategies utilized to build consumer networks through product formation, organization expansion, partnerships, mergers, and acquisitions.

Sources of Information

  • Primary Research: Email communication and phone interviews are two popular methods of doing primary research. Interviewing people can help to check data and information, create secondary sources, and obtain data for the markets where secondary sources are not available. People commonly taking part in the process include CEOs, VPs, marketing/product managers, market intelligence managers, and national sales managers from the sector. External professionals including investment bankers, value specialists and research analysts knowledgeable in particular medical equipment markets are also involved.
  • Secondary Research: The research process requires conducting comprehensive secondary research of internal and external sources to acquire qualitative and quantitative market data. The initial step of the secondary research is to construct a list of companies and product mapping for market nodes. Following this, data and information from the public domain must be collected for these market nodes. Examples of secondary research sources include: financial reports, broker reports, investor presentations, and SEC filings; journals of industry, scientific journals and other specialized literature; patent and regulatory databases that are appropriate; documents from the national government and statistical databases; as well as news articles, press releases, and webcasts related to market participants.

1. Introduction 
1.1. Study Goal & Objective
1.2. Scope of Report
1.3. Research Methodology
1.4. Assumptions & Abbreviations
2. Market Overview
2.1. Global Au-Sn Solder Paste Market Introduction 
2.1.1. Global Au-Sn Solder Paste Market Size (US$ Million), 2021 – 2030
2.1.2. Global Au-Sn Solder Paste Market Opportunity Analysis Size, US$ Mn (2022 – 2030) 
2.1.3. Top Emerging Countries 
2.1.4. Top Dominating Countries
2.2. Macro- Economic Factor
2.2.1. Top Countries GDP Analysis
2.2.2.  Impact of Covid-19 on Global Au-Sn Solder Paste Market
2.3. Market Determinants
2.3.1. Market Driver
2.3.2. Market Restraints
2.3.3. Market Opportunities
2.4. Technology/Product Roadmap
2.5. Market Growth Opportunity Analysis
2.5.1. By Region
2.5.2. By Segment
3. Market Segmentation
3.1. Global Au-Sn Solder Paste Market Analysis, By Product Type
3.1.1. Segment Analysis
3.1.2. Segment Share Analysis (%),2022  & 2030
3.1.3. Market Size & Forecast (US$ Mn), By Product Type, 2021 – 2030
3.1.3.1. Au80Sn20
3.1.3.2. Au78Sn22
3.1.3.3. Others
3.2. Global Au-Sn Solder Paste Market Analysis, By Application
3.2.1. Segment Analysis
3.2.2. Segment Share Analysis (%),2022 & 2030
3.2.3. Market Size & Forecast (US$ Mn), By Application, 2021 – 2030
3.2.3.1. Radio Frequency Devices
3.2.3.2. Opto-electronic Devices
3.2.3.3. SAW (Surface Acoustic Waves) Filter
3.2.3.4. Quartz Oscillator
3.2.3.5. Others
4. Regional Analysis 
4.1. Regional Dashboard
4.2. Regional Analysis
4.3. Market Analysis and Forecast, by Region, US$ Mn (2021 – 2030)
4.4. North America Au-Sn Solder Paste Market Analysis
4.4.1. Market Size & Forecast, US$ Mn (2021 – 2030)
4.4.2. Market Growth Opportunity Analysis, US$ Mn (2022 – 2030)
4.4.3. Market Share Analysis, By Country (%), 2022 & 2030
4.4.4. Market Size & Forecast (US$ Mn), By Country, 2021 – 2030
4.4.4.1. U.S.
4.4.4.2. Canada
4.4.5. Market Size & Forecast (US$ Mn), By Product Type, 2021 – 2030
4.4.5.1. Au80Sn20
4.4.5.2. Au78Sn22
4.4.5.3. Others
4.4.6. Market Size & Forecast (US$ Mn), By Application, 2021 – 2030
4.4.6.1. Radio Frequency Devices
4.4.6.2. Opto-electronic Devices
4.4.6.3. SAW (Surface Acoustic Waves) Filter
4.4.6.4. Quartz Oscillator
4.4.6.5. Others
4.5. Europe Au-Sn Solder Paste Market Analysis
4.5.1. Market Size & Forecast, US$ Mn (2021 – 2030)
4.5.2. Market Growth Opportunity Analysis, US$ Mn (2022 – 2030)
4.5.3. Market Share Analysis, By Country (%),2022 & 2030
4.5.4. Market Size & Forecast (US$ Mn), By Country, 2021 – 2030
4.5.4.1. Germany
4.5.4.2. U.K.
4.5.4.3. France
4.5.4.4. Italy
4.5.4.5. Spain
4.5.4.6. Russia
4.5.4.7. Rest of Europe
4.5.5. Market Size & Forecast (US$ Mn), By Product Type, 2021 – 2030
4.5.5.1. Au80Sn20
4.5.5.2. Au78Sn22
4.5.5.3. Others
4.5.6. Market Size & Forecast (US$ Mn), By Application, 2021 – 2030
4.5.6.1. Radio Frequency Devices
4.5.6.2. Opto-electronic Devices
4.5.6.3. SAW (Surface Acoustic Waves) Filter
4.5.6.4. Quartz Oscillator
4.5.6.5. Others
4.6. Asia Pacific Au-Sn Solder Paste Market Analysis
4.6.1. Market Size & Forecast, US$ Mn (2021 – 2030)
4.6.2. Market Growth Opportunity Analysis, US$ Mn (2022 – 2030)
4.6.3. Market Share Analysis, By Country (%),2022 & 2030
4.6.4. Market Size & Forecast (US$ Mn), By Country, 2021 – 2030
4.6.4.1. China
4.6.4.2. Japan
4.6.4.3. India
4.6.4.4. South Korea
4.6.4.5. Indonesia
4.6.4.6. Australia & New Zealand
4.6.4.7. ASEAN Countries
4.6.4.8. Rest of Asia Pacific
4.6.5. Market Size & Forecast (US$ Mn), By Product Type, 2021 – 2030
4.6.5.1. Au80Sn20
4.6.5.2. Au78Sn22
4.6.5.3. Others
4.6.6. Market Size & Forecast (US$ Mn), By Application, 2021 – 2030
4.6.6.1. Radio Frequency Devices
4.6.6.2. Opto-electronic Devices
4.6.6.3. SAW (Surface Acoustic Waves) Filter
4.6.6.4. Quartz Oscillator
4.6.6.5. Others
4.7. Middle East & Africa Au-Sn Solder Paste Market Analysis
4.7.1. Market Size & Forecast, US$ Mn (2021 – 2030)
4.7.2. Market Growth Opportunity Analysis, US$ Mn (2022 – 2030)
4.7.3. Market Share Analysis, By Country (%),2022 & 2030
4.7.4. Market Size & Forecast (US$ Mn), By Country, 2021 – 2030
4.7.4.1. GCC
4.7.4.2. Egypt
4.7.4.3. South Africa
4.7.4.4. Rest of Middle East & Africa
4.7.5. Market Size & Forecast (US$ Mn), By Product Type, 2021 – 2030
4.7.5.1. Au80Sn20
4.7.5.2. Au78Sn22
4.7.5.3. Others
4.7.6. Market Size & Forecast (US$ Mn), By Application, 2021 – 2030
4.7.6.1. Radio Frequency Devices
4.7.6.2. Opto-electronic Devices
4.7.6.3. SAW (Surface Acoustic Waves) Filter
4.7.6.4. Quartz Oscillator
4.7.6.5. Others
4.8. Latin America Au-Sn Solder Paste Market Analysis
4.8.1. Market Size & Forecast, US$ Mn (2021 – 2030)
4.8.2. Market Growth Opportunity Analysis, US$ Mn (2022 – 2030)
4.8.3. Market Share Analysis, By Country (%), 2022 & 2030
4.8.4. Market Size & Forecast (US$ Mn), By Country, 2021 – 2030
4.8.4.1. Brazil
4.8.4.2. Mexico
4.8.4.3. Argentina
4.8.4.4. Rest of Latin America
4.8.5. Market Size & Forecast (US$ Mn), By Product Type, 2021 – 2030
4.8.5.1. Au80Sn20
4.8.5.2. Au78Sn22
4.8.5.3. Others
4.8.6. Market Size & Forecast (US$ Mn), By Application, 2021 – 2030
4.8.6.1. Radio Frequency Devices
4.8.6.2. Opto-electronic Devices
4.8.6.3. SAW (Surface Acoustic Waves) Filter
4.8.6.4. Quartz Oscillator
4.8.6.5. Others
5. Competitive Analysis
5.1. Company Share Analysis (%) 2022
5.2. List of Acquisition, Merger, Collaboration & New Product Launch
6. Company Profiles (Company Overview, Financial Analysis, Product Offerings, Market Strategies)
6.1. Mitsubishi Materials Corporation
6.2. Indium Corporation
6.3. AIM Solder
6.4. Chengdu Apex New Materials Co., Ltd.
6.5. Guangzhou Xianyi Electronic Technology Co.,Ltd.
6.6. Shenzhen Fuyingda Industry Technology Co., Ltd.
 

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